Technological Breakthrough | Hongsheng Machinery Successfully Develops 1.8m Ultra-High-Precision 7075 Semiconductor Cavity
Dalian Hongsheng Machinery has successfully developed a high-precision 1.8m 7075 aluminum hollow cavity for semiconductor equipment. By adopting six-stage stress relief and gantry multi-axis linkage machining, we solved large workpiece deformation problems. The product features 8μm flatness, 0.01mm position tolerance, 2μm cylindricity and Ra0.6 traceless surface, meeting top semiconductor industry standards.
Jul 19,2026
